⏰ Full-time

Memory Packaging Technical Manager

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MediaTek

                    Location
                    📍 Hsinchu City, Taiwan
                

                    Posted
                    📅 May 29, 2026
                

                    Work Type
                    ⏰ Full-time
                

Position Overview

                    Job DescriptionProduct 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM developmentRequirement1. >10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus. 2. Familiar with memory design, architecture, process, packaging, materials… 3. Project handling experience
                

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Job Details

⏰

Employment Type

Full-time

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