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Mechanical and Thermal Analysis of Advanced Packaged Devices Intern

Advanced Micro Devices, Inc
Location 📍 Singapore, Singapore
Posted 📅 June 06, 2026
Work Type ⏰ Full-time

Position Overview




As an AMD [intern/co-op], you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

LOCATION: SingaporeCRITERIA: Current students studying in Universities which are based in SingaporeINTERNSHIP DURATION: The internship will begin on either 4 May 2026 or 20 July 2026, and will end on 4 Dec 2026. There is an option to extend the internship, with the extended period concluding on a fixed date of 18 Dec 2026.Intern- Mechanical and Thermal Analysis of Advanced Packaged DevicesWHAT YOU CAN EXPECT TO LEARN:
  • Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconduc...
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    Job Details

    Employment Type
    Full-time
    📊
    Category
    Engineers
    🏠
    Work Arrangement
    On-site
    📍
    Location
    Singapore, Singapore