Micron MSB is seeking a passionate and driven intern to join our Assembly Process Engineering team. This internship offers hands‑on exposure to advanced semiconductor packaging processes, focusing on Flip Chip Attach and Underfill technologies. The ideal candidate will be part of a project to drive process development, yield improvement, and data‑driven decision‑making. A strong foundation in statistics and AI programming is a plus and will be leveraged to enhance process analysis and automation.

• Set up, execute, and analyze Flip Chip Attach and Underfill process experiments.
• Collaborate with cross‑functional teams to troubleshoot and resolve process issues and work on engineering projects.
• Apply statistical methods to analyze process data and identify trends or anomalies.
• Explore AI‑based approaches for predictive modeling and process optimization.

• A final p...