**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As an **SoC Design Engineer** , you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet aggressive power, performance, area, and schedule targets.

This is a hands‑on technical role focused on RTL design, IP integration, debug, and pre‑/post‑silicon support.

**Key Responsibilities**

+ Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die.