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HBM Packaging Engineer – NPI & High-Speed Memory

Micron Technology, Inc
Location 📍 singapore, Singapore
Posted 📅 June 04, 2026
Work Type ⏰ Full-time

Position Overview

Micron Technology, Inc in Singapore is seeking an Engineer for the High Bandwidth Memory and New Product Introduction team. This role involves integrating AI-assisted tools to enhance product transitions from development to high-volume manufacturing.

The ideal candidate will have a degree in a relevant engineering field and strong analytical skills. Responsibilities include risk assessments and collaboration with manufacturing teams.

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Job Details

Employment Type
Full-time
📊
Category
Other-General
🏠
Work Arrangement
On-site
📍
Location
singapore, Singapore