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HBM IO Architecture, Principal Engineer

Micron Technology, Inc.
Location 📍 Richardson, United States
Posted 📅 May 31, 2026
Work Type ⏰ Full-time

Position Overview

**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Heterogeneous Integration Group (HIG) sits within Micron’s Technology and Products Group and is at the heart of our HBM innovation. We design and optimize industry‑leading HBM solutions that power AI, ML, and high‑performance computing platforms. By combining TSV technology, advanced IO architectures, and deep system‑level thinking, we deliver the highest bandwidth with the lowest power per bit in the industry.

As a Principal Engineer in HBM IO Design Architecture, you will be the technical authority for HBM IO circuits and PHY architecture. You will lead multi‑generation IO initiatives spanning TSV link definition, PHY circuit architecture,...

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Job Details

Employment Type
Full-time
📊
Category
other-general
🏠
Work Arrangement
On-site
📍
Location
Richardson, United States