Duration: ASAP – 3 months, 5.5 days/week, choose from A/B/C A: 6:45 am – 3:15 pm B: 2:45 pm – 11:15 pm C: 10:45 pm – 7:15 am

Job scope:

Conduct machine calibration, setup, and validation for semiconductor packaging equipment in accordance with established procedures.

Provide Level 1 technical support to troubleshoot assembly and process issues to achieve target yield and cycle time.

Support Process Engineers in developing and qualifying inspection protocols and equipment integrity tests.

Assist in improving process recipes, tooling, and manufacturing workflows, including documentation updates.

Ensure required fixtures, jigs, drawings, and work instructions are prepared and available for production.

Record and maintain accurate manufacturing test data and generate quality reports as required.

Requirements:

Diploma in Engineering (Materials Science, Electrical, Mechanical or equivalent) with minimu...