We are looking for a Failure Analysis Engineer to perform chip‑level and system‑level failure analysis on semiconductor IC devices. This role focuses on identifying the root cause of failures using advanced electrical and physical analysis tools. You will work closely with Product Engineering, Design Engineering, Quality, and Foundry teams to troubleshoot issues, isolate defects, and support corrective actions. This position requires strong analytical skills, technical curiosity, and the ability to collaborate across multi‑national and cross‑functional teams. Key Responsibilities Perform failure analysis on complex semiconductor device issues using creative problem‑solving. Act as the case owner for multiple devices and investigations. Use electrical fault isolation tools, including: Static laser techniques: XIVA, OBIRCH, Photo Emission, Lock‑In Thermal Microscopy. Dynamic laser stimulation and thermal/photonic fault injection. Conduct non‑destructive testing using X-ray, C‑SAM, and ad...