This job requires a full-time Staff engineer with strong engineering knowledge and skills in wire bond equipment and process for early engagement in technical problem-solving, cross-site collaboration to support NPD qualification and high-volume manufacturing (HVM)
Lead the development, optimization, and qualification of wirebond processes for new and existing semiconductor packages, ensuring robust manufacturability, reliability compliance, and alignment with technology roadmaps.
Good knowledge in Six Sigma methodology and the DMAIC approach.
Practice good quality system and production control.
Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.
Requirements:
Minimum Bachelor's / Master Degree in Electronic, Electrical, Microelectronic, Mechatronic Engineering or equivalent.