Lead end-to-end surface treatment workflows (Cleaning, Polishing, Anodizing, Plating, etc.) from NPI through Mass Production, ensuring seamless transitions between internal and external stages.
Hands‑on management of in‑house Cleaning, Polishing and Laboratory bath analysis.
Act as the technical lead for 3rd‑party surface treatment vendors.
Conduct process audits, review chemical bath reports, and ensure suppliers meet semiconductor‑grade purity and cosmetic standards.
Lead Failure Analysis (FA) for defects such as pitting, discoloration, or outgassing issues. Distinguish whether defects originated from in‑house machining, cleaning, or 3rd‑party plating.
Drive First Article Inspection (FAI) and process qualification (IQ/OQ/PQ) for new parts.
Establish and maintain robust SOPs, WIs, PFMEAs, and Control Plans. Ensure all chemical handling aligns with environmental and safety regulations.