Responsibilities: Plating Process Engineering Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.) Monitor plating bath performance through regular analysis and corrective actions Perform DOE, capability studies, and process qualification for new plating chemistry or equipment Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion Establish and maintain plating process parameters, SOPs, and control plans Wet Process Support (Etching, Cleaning, Stripping) Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning Monitor and sustain wet chemistry tanks (etchants, cleaners, developers, strippers) through SPC and scheduled chemical analysis Drive root-cause analysis for wet process issues including over-etch, under-etch, resi...