Position Overview
Responsibilities Plating Process Engineering - Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)
- Monitor plating bath performance through regular analysis and corrective actions
- Perform DOE, capability studies, and process qualification for new plating chemistry or equipment
- Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion
- Establish and maintain plating process parameters, SOPs, and control plans
Wet Process Support (Etching, Cleaning, Stripping) - Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity
- Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning
- Monitor and sustain wet chemistry tanks (etchants, cleaners, developers, strippers) through SPC and ...