As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.
 

You will play a key role in driving equipment strategy, introducing advanced technologies, resolving complex technical challenges, and enhancing manufacturing performance in terms of cost, quality, and capability.

This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.


What You Will Do

Equipment & Technology Strategy