Position Overview
Responsibilities
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Producing and implementing designs to meet customer specifications for:Low cost and thermally efficient package platformsLTE, carrier aggregation, multiple antennas, filters, and power managementRuggedness, ESD, and qualityMeeting performance requirements while also considering size, cost, footprint, and scheduleWorking with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab dataPartnering with technicians to perform circuit simulations and testing as neededDesigning, testing, and tuning of RF PAsDeveloping and executing test plans for electronics package mechanical robustnessDeveloping application guidelines for package assembly into next level assemblyCreating basic algorithms for automating FEA model generationPotential to work with:Sig...