Micron Technology in Batu Kawan, Malaysia is seeking candidates for a project focused on enhancing Non-Stick On Pad (NSOP) detection in the Wire Bond process. The role involves defining failure criteria, improving alarm logic, and collaborating with engineering teams to reduce downtime. Ideal candidates should have a background in Electrical, Equipment, or Manufacturing Engineering. Micron offers a dynamic environment for those eager to innovate in memory and storage solutions.
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