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Application Engineer for Bonder and Imaging Solutions (m/f/d)

SÜSS MicroTec AG
Location 📍 singapore, Singapore
Posted 📅 May 24, 2026
Work Type ⏰ Full-time

Position Overview

Big ideas often start small - sometimes smaller than a speck of dust. Microchips power the tools and devices we rely on every day - from smartphones and electric vehicles to medical diagnostics and AI systems. SUSS equipment enables their production through scalable, high-precision solutions in lithography, wafer bonding, and packaging. With over 75 years of experience and a global presence, we are a trusted partner that combines reliability and innovative strength.

We are guided by the conviction that innovation is not only created by technology, but by people who take responsibility and overcome boundaries together.

Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market. We are looking for the next possible date

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Job Details

Employment Type
Full-time
📊
Category
Software Architecture & Engineering
🏠
Work Arrangement
On-site
📍
Location
singapore, Singapore