**Job Description Summary**
Are you ready to see your career take flight? At GE Aerospace, we believe the world works better when it flies. We are a world-leading provider of jet engines, components, and integrated systems for commercial and military aircraft. We have a relentless dedication to the future of safe and more sustainable flight and believe in our talented people to make it happen.

The Advanced Lead – SiC/GaN Power Module Packaging Engineer will focus on the design of power modules along with development, optimization, and implementation of manufacturing processes for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high-efficiency high power density power electronics.

In this role, you will be responsible for developing, optimizing, and implementing manufacturing processes for existing and new Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules. You will participate in power module design and simulat...